完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.author | Shui, Chi-Hui | en_US |
dc.contributor.author | Chen, Hung-Ming | en_US |
dc.date.accessioned | 2017-04-21T06:49:15Z | - |
dc.date.available | 2017-04-21T06:49:15Z | - |
dc.date.issued | 2008 | en_US |
dc.identifier.isbn | 978-1-4244-1616-5 | en_US |
dc.identifier.uri | http://hdl.handle.net/11536/135065 | - |
dc.description.abstract | Due to advanced technology manufacturing variations, dummy metal insertion becomes the key, process of VLSI fabrication in reducing wafer-topography variation in Al-based and Cu-based [4] chemical mechanical polishing(CMP) processes. In this paper, we propose a faster and more effective approach to dealing with inter-layer dielectric (ILD) CMP issue, called Effective Model-based Dummy Insertion (EMDI). EMDI selects panels to insert dummy metal by effective CMP low pass filter model [8], and obtain feasible solutions with good quality based on minimized effective density. Compared with previous linear programming approach [10] that costs O(n(3)) (pale have n * n panels in chip layout), EMDI is quite fast in O(n log n) which is dominate by fast fourier transformation, same complexity as in [11]. Multi-layer dummy metal insertion is considered in our framework as well. The experiments on a real design show that our approach has outperformed the approach in [11], and is more efficient and effective in the smoothness of metal layers. | en_US |
dc.language.iso | en_US | en_US |
dc.title | On minimizing topography variation in multi-layer oxide CMP manufacturability | en_US |
dc.type | Proceedings Paper | en_US |
dc.identifier.journal | 2008 INTERNATIONAL SYMPOSIUM ON VLSI DESIGN, AUTOMATION AND TEST (VLSI-DAT), PROCEEDINGS OF TECHNICAL PROGRAM | en_US |
dc.citation.spage | 39 | en_US |
dc.citation.epage | + | en_US |
dc.contributor.department | 電子工程學系及電子研究所 | zh_TW |
dc.contributor.department | Department of Electronics Engineering and Institute of Electronics | en_US |
dc.identifier.wosnumber | WOS:000256565800009 | en_US |
dc.citation.woscount | 0 | en_US |
顯示於類別: | 會議論文 |