A LOW TEMPERATURE INKJET PRINTING AND FILLING PROCESS FOR LOW RESISTIVE SILVER TSV FABRICATION IN A SU-8 SUBSTRATE

Title:	A LOW TEMPERATURE INKJET PRINTING AND FILLING PROCESS FOR LOW RESISTIVE SILVER TSV FABRICATION IN A SU-8 SUBSTRATE
Authors:	Yang, Tsung-Han Guo, Zi-Li Fu, Yu-Min Cheng, Yu-Ting Song, Yen-Fang Wu, Pu-Wei 加速器光源科技與應用學位學程電子工程學系及電子研究所 Master and Ph.D. Program for Science and Technology of Accelrrator Light Source Department of Electronics Engineering and Institute of Electronics
Issue Date:	1-Jan-2017
Abstract:	The paper presents a low temperature (with 60 degrees C) inkjet printing and filling process to realize low resistive Ag TSV (Through Substrate Vias) with the aspect ratio of via depth vs. diameter from 2 to 5 in a SU-8 substrate potential for flexible microsystem packaging applications. Combining humidity control and layer-by-layer Ag mirror reaction, the proposed process technology can accomplish a fully filled TSV with the lowest electrical resistivity of similar to 450 mu Omega.cm in comparison with the prior printing and filling technologies.
URI:	http://hdl.handle.net/11536/146590
ISSN:	1084-6999
Journal:	30TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2017)
Begin Page:	749
End Page:	752
Appears in Collections:	Conferences Paper

APA	Yang, T., Guo, Z., Fu, Y., Cheng, Y., Song, Y., & Wu, P. (2017). LOW TEMPERATURE INKJET PRINTING AND FILLING PROCESS FOR LOW RESISTIVE SILVER TSV FABRICATION IN A SU-8 SUBSTRATE. WOS:000402552000193.
Bibtex	@article{Yang2017LOW, title={LOW TEMPERATURE INKJET PRINTING AND FILLING PROCESS FOR LOW RESISTIVE SILVER TSV FABRICATION IN A SU-8 SUBSTRATE}, author={Yang, Tsung-Han and Guo, Zi-Li and Fu, Yu-Min and Cheng, Yu-Ting and Song, Yen-Fang and Wu, Pu-Wei}, journal={WOS:000402552000193}, year={2017}, url={http://ir.lib.nycu.edu.tw/handle/11536/146590}, }