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Showing results 21 to 39 of 39 < previous 
Issue DateTitleAuthor(s)
1-Jan-1998Electrical properties of O-2 and N-2 annealed (Ba,Sr)TiO3 thin filmsTsai, MS; Sun, SC; Tseng, TY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Mar-2002Electrochemical behavior of copper chemical mechanical polishing in KIO3 slurryHsu, JW; Chiu, SY; Tsai, MS; Dai, BT; Feng, MS; Shih, HC; 材料科學與工程學系; Department of Materials Science and Engineering
1-May-2001Elimination of dielectric degradation for chemical-mechanical planarization of low-k hydrogen silisesquioxaneChang, TC; Liu, PT; Tsai, TM; Yeh, FS; Tseng, TY; Tsai, MS; Chen, BC; Yang, YL; Sze, SM; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Jun-2002Expression, characterization, and purification of recombinant porcine lactoferrin in Pichia pastorisWang, SH; Yang, TS; Lin, SM; Tsai, MS; Wu, SC; Mao, SJT; 生物科技學系; Department of Biological Science and Technology
1-Jul-2001Highly reliable chemical-mechanical polishing process for organic low-k methylsilsesquioxaneLiu, PT; Chang, TC; Huang, MC; Tsai, MS; Sze, SM; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2002Impact of airborne molecular contamination to nano-device performanceYeh, CF; Hsiao, CW; Lin, SJ; Xie, ZM; Kusumi, T; Aomi, H; Kaneko, H; Da, BT; Tsai, MS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Nov-2000Improvement of post-chemical mechanical planarization characteristics on organic low k methylsilsesquioxane as intermetal dielectricLiu, PT; Chang, TC; Huang, MC; Yang, YL; Mor, YS; Tsai, MS; Chung, H; Hou, J; Sze, SM; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
15-Oct-1999Nitric acid-based slurry with citric acid as an inhibitor for copper chemical mechanical polishingHu, TC; Chiu, SY; Dai, BT; Tsai, MS; Tung, IC; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-Jul-2000Novel cleaning solutions for polysilicon film post chemical mechanical polishingPan, TM; Lei, TF; Chen, CC; Chao, TS; Liaw, MC; Yang, WL; Tsai, MS; Lu, CP; Chang, WH; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Nov-1999The novel precleaning treatment for selective tungsten chemical vapor depositionChang, TC; Mor, YS; Liu, PT; Sze, SM; Yang, YL; Tsai, MS; Chang, CY; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
2005Pattern effect optimized with non-native surface passivation in copper abrasive-free polishingFang, JY; Tsai, MS; Dai, BT; Wu, YS; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1-Nov-2004Post-Cu CMP cleaning for colloidal silica abrasive removalChen, PL; Chen, JH; Tsai, MS; Dai, BT; Yeh, CF; 材料科學與工程學系; 電子工程學系及電子研究所; Department of Materials Science and Engineering; Department of Electronics Engineering and Institute of Electronics
1-May-2004The removal of airborne molecular contamination in cleanroom using PTFE and chemical filtersYeh, CF; Hsiao, CW; Lin, SJ; Hsieh, CM; Kusumi, T; Aomi, H; Kaneko, H; Dai, BT; Tsai, MS; 電子工程學系及電子研究所; Department of Electronics Engineering and Institute of Electronics
1-Mar-2002The removal selectivity of titanium and aluminum in chemical mechanical planarizationHsu, JW; Chiu, SY; Wang, YL; Dai, BT; Tsai, MS; Feng, MS; Shih, HC; 材料科學與工程學系; Department of Materials Science and Engineering
1-May-2000Retardation in the chemical-mechanical polish of the boron-doped polysilicon and siliconYang, WL; Cheng, CY; Tsai, MS; Liu, DG; Shieh, MS; 交大名義發表; National Chiao Tung University
1-Jul-2001Selective copper metallization by electrochemical contact displacement with amorphous silicon filmLee, YP; Tsai, MS; Hu, TC; Dai, BT; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
2000Study on chemical-mechanical polishing of low dielectric constant polyimide thin filmsTai, YL; Tsai, MS; Tung, IC; Dai, BT; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
1999A study on electrochemical metrologies for evaluating the removal selectivity of AlCMPChiu, SY; Hsu, JW; Tung, IC; Shih, HC; Feng, MS; Tsai, MS; Dai, BT; 材料科學與工程學系; Department of Materials Science and Engineering
2006Study on pressure-independent Cu removal in Cu abrasive-free polishingFang, JY; Huang, PW; Tsai, MS; Dai, BT; Wu, YS; Feng, MS; 材料科學與工程學系; Department of Materials Science and Engineering
Showing results 21 to 39 of 39 < previous