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dc.contributor.authorChang Edward Yi.en_US
dc.contributor.authorLin Yueh-Chinen_US
dc.contributor.authorChang Chia-Huaen_US
dc.contributor.authorTrinh Hai-Dangen_US
dc.date.accessioned2014-12-16T06:14:58Z-
dc.date.available2014-12-16T06:14:58Z-
dc.date.issued2013-06-20en_US
dc.identifier.govdocH01L029/12zh_TW
dc.identifier.govdocH01L021/02zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/105036-
dc.description.abstractThe present invention relates to a semiconductor device and a manufacturing method thereof. The semiconductor device includes: a III-V semiconductor layer; an aluminum oxide layer formed on the III-V semiconductor layer; and a lanthanide oxide layer formed on the aluminum oxide layer. The method of manufacturing a semiconductor device includes: forming an aluminum oxide layer between a III-V semiconductor layer and a lanthanide oxide layer so as to prevent an inter-reaction of atoms between the III-V semiconductor layer and the lanthanide oxide layer.zh_TW
dc.language.isozh_TWen_US
dc.titleSEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFzh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20130153886zh_TW
Appears in Collections:Patents


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