1. You are Here：

Full metadata record
DC FieldValueLanguage
dc.contributor.authorChang, Edward Yien_US
dc.contributor.authorWu, Wei-Chengen_US
dc.contributor.authorHwang, Ruey-Bingen_US
dc.contributor.authorHsu, Li-Hanen_US
dc.date.accessioned2014-12-16T06:15:45Z-
dc.date.available2014-12-16T06:15:45Z-
dc.date.issued2009-10-29en_US
dc.identifier.govdocH01L023/498zh_TW
dc.identifier.govdocH01P001/00zh_TW
dc.identifier.urihttp://hdl.handle.net/11536/105471-
dc.description.abstractA vertical transmission structure for high frequency transmission lines includes a conductive axial core and a conductive structure surrounding the conductive axial core. The vertical transmission structure is applied to a high-frequency flip chip package for reducing the possibility of underfill from coming in contact with the conductive axial core.zh_TW
dc.language.isozh_TWen_US
dc.titleVertical Transmission Structurezh_TW
dc.typePatentsen_US
dc.citation.patentcountryUSAzh_TW
dc.citation.patentnumber20090267201zh_TW
Appears in Collections:Patents


Files in This Item:

  1. 20090267201.pdf

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.

Related Contents
Loading...