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dc.contributor.authorKer, Ming-Douen_US
dc.contributor.authorChiu, Po-Yenen_US
dc.date.accessioned2014-12-08T15:27:19Z-
dc.date.available2014-12-08T15:27:19Z-
dc.date.issued2011-09-01en_US
dc.identifier.issn1530-4388en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TDMR.2010.2066976en_US
dc.identifier.urihttp://hdl.handle.net/11536/19581-
dc.description.abstractA new low-leakage power-rail electrostatic discharge (ESD) clamp circuit designed with consideration of the gate leakage issue has been proposed and verified in a 65-nm low-voltage CMOS process. Consisting of the new low-leakage ESD-detection circuit and the ESD clamp device of a substrate-triggered silicon-controlled rectifier, the new proposed power-rail ESD clamp circuit realized with only thin-oxide (1-V) devices has a very low leakage current of only 116 nA at room temperature (25 degrees C) under the power-supply voltage of 1 V. Moreover, the new proposed power-rail ESD clamp circuit can achieve ESD robustness of over 8 kV, 800 V, and over 2 kV in human-body-model, machine-model, and charged-device-model ESD tests, respectively.en_US
dc.language.isoen_USen_US
dc.subjectElectrostatic discharge (ESD)en_US
dc.subjectgate leakageen_US
dc.subjectpower-rail ESD clamp circuiten_US
dc.subjectsubstrate-triggered silicon-controlled rectifier (STSCR)en_US
dc.titleNew Low-Leakage Power-Rail ESD Clamp Circuit in a 65-nm Low-Voltage CMOS Processen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TDMR.2010.2066976en_US
dc.identifier.journalIEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITYen_US
dc.citation.volume11en_US
dc.citation.issue3en_US
dc.citation.spage474en_US
dc.citation.epage483en_US
dc.contributor.department電機學院zh_TW
dc.contributor.departmentCollege of Electrical and Computer Engineeringen_US
dc.identifier.wosnumberWOS:000294856900015-
dc.citation.woscount3-
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