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dc.contributor.authorLiang, Y. C.en_US
dc.contributor.authorLin, H. W.en_US
dc.contributor.authorChen, H. P.en_US
dc.contributor.authorChen, C.en_US
dc.contributor.authorTu, K. N.en_US
dc.contributor.authorLai, Y. S.en_US
dc.date.accessioned2014-12-08T15:30:34Z-
dc.date.available2014-12-08T15:30:34Z-
dc.date.issued2013-07-01en_US
dc.identifier.issn1359-6462en_US
dc.identifier.urihttp://dx.doi.org/10.1016/j.scriptamat.2013.03.018en_US
dc.identifier.urihttp://hdl.handle.net/11536/21840-
dc.description.abstractThe evolution of eutectic structure under temperature cycling tests (TCTs) in SnPb composite solder joints has been investigated. After 500 cycles of TCT, the Sn grains coarsened and developed anisotropic stripes close to the necking site in the solder joint because of stress-induced atomic migration. Then, cracks triggered by thermal stress were observed to propagate along the Sn stripe interfaces. After a prolonged 14,410 cycles of TCT, the cracks expanded across the entire solder joint and led to electrical open failure. (c) 2013 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.en_US
dc.language.isoen_USen_US
dc.subjectStress migrationen_US
dc.subjectDiffusionen_US
dc.subjectTemperature cycling testen_US
dc.subjectSnPb composite solder jointen_US
dc.titleAnisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder jointsen_US
dc.typeArticleen_US
dc.identifier.doi10.1016/j.scriptamat.2013.03.018en_US
dc.identifier.journalSCRIPTA MATERIALIAen_US
dc.citation.volume69en_US
dc.citation.issue1en_US
dc.citation.spage25en_US
dc.citation.epage28en_US
dc.contributor.department材料科學與工程學系zh_TW
dc.contributor.departmentDepartment of Materials Science and Engineeringen_US
dc.identifier.wosnumberWOS:000319545100007-
dc.citation.woscount2-
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