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dc.contributor.authorChao, CJen_US
dc.contributor.authorWong, SCen_US
dc.contributor.authorKao, CHen_US
dc.contributor.authorChen, MJen_US
dc.contributor.authorLeu, LYen_US
dc.contributor.authorChiu, KYen_US
dc.date.accessioned2014-12-08T15:42:50Z-
dc.date.available2014-12-08T15:42:50Z-
dc.date.issued2002-02-01en_US
dc.identifier.issn0894-6507en_US
dc.identifier.urihttp://dx.doi.org/10.1109/TSM.2002.983440en_US
dc.identifier.urihttp://hdl.handle.net/11536/29043-
dc.description.abstractThe paper presents a complete characterization of on-chip inductors fabricated in BiCMOS technology. First, a study of the scaling effect of inductance on geometry and structure parameters is presented to provide a clear guideline on inductor scaling with suitable quality factors. The substrate noise analysis and noise reduction techniques are then investigated. It is shown that floating well can improve both quality factor and noise elimination by itself under 3 GHz and together with a guard ring above 3 GHz. Finally, for accurate circuit simulations, a new inductor model is developed for predicting the skin effect and eddy effect and associated quality factor and inductance.en_US
dc.language.isoen_USen_US
dc.subjectequivalent lumped circuiten_US
dc.subjectinductorsen_US
dc.subjectmodelingen_US
dc.subjectskin effecten_US
dc.titleCharacterization and Modeling of on-chip spiral inductors for Si RFICsen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/TSM.2002.983440en_US
dc.identifier.journalIEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURINGen_US
dc.citation.volume15en_US
dc.citation.issue1en_US
dc.citation.spage19en_US
dc.citation.epage29en_US
dc.contributor.department電子工程學系及電子研究所zh_TW
dc.contributor.departmentDepartment of Electronics Engineering and Institute of Electronicsen_US
dc.identifier.wosnumberWOS:000173843400003-
dc.citation.woscount24-
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