Comparison of oxide breakdown progression in ultra-thin oxide silicon-on-insulator and bulk metal-oxide-semiconductor field effect transistors

Abstract

Enhanced oxide breakdown progression in ultra-thin oxide silicon-on-insulator p-type metal-oxide-semiconductor field-effect transistors is observed, as compared to bulk devices. The enhanced progression is attributed to the increase of hole stress current resulting from breakdown induced channel carrier heating in a floating-body configuration. Numerical analysis of hole tunneling current and hot carrier luminescence measurement are performed to support our proposed theory. This phenomenon is particularly significant to the reliability of devices with ultra-thin oxides and low operation gate voltage. (C) 2004 American Institute of Physics.