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Copper electroplating for future ultralarge scale integration interconnection (vol 18, pg 656, 2000)
Copper electroplating for future ultralarge scale integration interconnection (vol 18, pg 656, 2000)
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000089434800087.pdf
(211.91 KB)
Date
2000-09-01
Authors
Gau, WC
Chang, TC
Lin, YS
Hu, JC
Chen, LJ
Chang, CY
Cheng, CL
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DOI
10.1116/1.1286102
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http://dx.doi.org/10.1116/1.1286102
https://ir.lib.nycu.edu.tw/handle/11536/30314
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