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深次微米互補式金氧半製程技術下之混合電壓輸出入界面電路與靜電放電防護電路的設計
深次微米互補式金氧半製程技術下之混合電壓輸出入界面電路與靜電放電防護電路的設計
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892215E009103.pdf
(30.38 KB)
Date
2000
Authors
柯明道
KER MING-DOU
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https://www.grb.gov.tw/search/planDetail?id=583886&docId=109706
https://ir.lib.nycu.edu.tw/handle/11536/93852
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