三維積體電路(3D IC)之矽晶直通孔(TSV)與其它關鍵技術製程整合研究及應力量測熱傳導模型分析( III )

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2012

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https://www.grb.gov.tw/search/planDetail?id=2645670&docId=399140
 https://ir.lib.nycu.edu.tw/handle/11536/98389

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研究計畫;;Research Plans

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