半導體廠WIP Profile之管理模式

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882213E009032.pdf (325.6 KB)

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Keywords

在製品, 晶圓製造, 機器當機, 派工法則, Work in process (WIP), Wafer fabrication, Machine breakdown, Dispatching rule

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https://www.grb.gov.tw/search/planDetail?id=443243&docId=80223
https://ir.lib.nycu.edu.tw/handle/11536/94569

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研究計畫;;Research Plans