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Erratum: "Thermomigration in flip-chip SnPb solder joints under alternate current stressing" [Appl. Phys. Lett. 90, 152105 (2007)]

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000247305400119.pdf (323.54 KB)

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2007-06-11

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10.1063/1.2748851

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http://dx.doi.org/10.1063/1.2748851
 https://ir.lib.nycu.edu.tw/handle/11536/10692

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