球柵矩陣型積體電路焊線製程參數最佳化之設計

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902218E009008.pdf (54.38 KB)
 902218E009008.pdf (54.38 KB)

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2001

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引線接合, 球柵矩陣型積體電路, 製程設計, 最佳化, Wire bonding, BGA, Process design, Optimization

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https://www.grb.gov.tw/search/planDetail?id=674233&docId=128513
 https://ir.lib.nycu.edu.tw/handle/11536/96785

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研究計畫;;Research Plans

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