高密度電子構裝接合與測試載具之開發---以SPICE對積體電路與構裝基板之高效率熱模擬與電性分析(I)

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1997

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構裝, 電導係數, 熱傳導率, 多晶片模組, Packaging, Electrical conductivity, Thermal conductivity, MCM, SPICE

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https://www.grb.gov.tw/search/planDetail?id=271930&docId=48506
 https://ir.lib.nycu.edu.tw/handle/11536/95536

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研究計畫;;Research Plans

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