SPICE上多網目式電路板溫度模擬模式之建立

Date

Authors

Keywords

SPICE , 印刷電路板 , 熱傳導 , 熱對流 , 熱輻射 , 有限差分法 , SPICE , Printed circuit board , Thermal conduction , Thermal convection , Thermalradiation , Finite difference method

URI

https://www.grb.gov.tw/search/planDetail?id=225618&docId=40546
https://ir.lib.nycu.edu.tw/handle/11536/96091

Collections

研究計畫;;Research Plans