A 1 Tbit/s Bandwidth 1024 b PLL/DLL-Less eDRAM PHY Using 0.3 V 0.105 mW/Gbps Low-Swing IO for CoWoS Application
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DOI
10.1109/JSSC.2013.2297399
Abstract
A 1 Tbit/ s bandwidth PHY is demonstrated through CoWoS(TM) platform. Two chips: SOC and embedded DRAM ( eDRAM), have been fabricated in TSMC 40 nm CMOS technology and stacked on a silicon interposer chip. 1024 DQ buses operating at 1.1 Gbit/ s with VDDQ = 0.3 V are proven between SOC chip and eDRAM chip in experimental results with 1 mm signal trace length on the silicon interposer. A novel timing compensation mechanism is presented to achieve a low- power and small area eDRAM PHY that excludes PLL/ DLL but retains good timing margin. Another data sampling alignment training approach is employed to enhance timing robustness. A compact low- swing IO also achieves power efficiency of 0.105 mW/ Gbps.
Description
Keywords
Chip on wafer on substrate , CoWoS , DLL , eDRAM , low-swing IO , micro-bump , PHY , PLL , SII , silicon-interposer , timing compensation , 2.5D-IC.