Thermal-Aware Logic Block Placement for 3D FPGAs Considering Lateral Heat Dissipation

Date

Authors

Huang, Juinn-Dar

Chang, Han-Yuan

Keywords

Three-dimensional integration , 3D FPGAs , thermal-aware placement , logic block placement

URI

https://ir.lib.nycu.edu.tw/handle/11536/16229

Collections

會議論文;;Conferences Paper