| Title: | 針對3D整合之電子設計自動化技術開發---子計畫四：立體堆疊晶片與系統級構裝之設計最佳化研究(II) 3D-SiC and 3D-SiP Design Planning (II) |
| Authors: | 陳宏明 Chen Hung-Ming 國立交通大學電子工程學系及電子研究所 |
| Keywords: | 三維度積體電路;封裝設計;flip-chip繞線 |
| Issue Date: | 2010 |
| Gov't Doc #: | NSC99-2220-E009-038 |
| URI: | http://hdl.handle.net/11536/100229 https://www.grb.gov.tw/search/planDetail?id=2159570&docId=347578 |
| Appears in Collections: | Research Plans |
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