以二階式生產流程模式構建半導體封裝現場流程管制系統

Title:	以二階式生產流程模式構建半導體封裝現場流程管制系統 A Two-Layer Manufacturing Process Model for the IC Packaging Shop Floor Control System
Authors:	李榮貴 LI RONG-KWEI 交通大學工業工程與管理系
Keywords:	二階式生產流程模式;半導體封裝業;批量流;現場流程管制系統;Two layer manufacturing process model;IC packaging industry;Batch flow;Shop floor control system
Issue Date:	2000
Gov't Doc #:	NSC89-2213-E009-046
URI:	http://hdl.handle.net/11536/101293 https://www.grb.gov.tw/search/planDetail?id=525220&docId=95517
Appears in Collections:	Research Plans

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