Title: | Method of semiconductor manufacturing process |
Authors: | Wu YewChung Sermon Wang Bau-Ming Hsiao Feng-Ching |
Issue Date: | 9-Dec-2014 |
Abstract: | The present invention related to a method for manufacturing a semiconductor, comprising steps of: providing a growing substrate; forming a semiconductor substrate on the growing substrate; forming a first structure with plural grooves and between the growing substrate and the semiconductor substrate; and changing the temperature of the growing substrate and the semiconductor substrate. |
Gov't Doc #: | H01L021/30 H01L021/46 H01L021/02 H01L021/18 H01L033/00 |
URI: | http://hdl.handle.net/11536/104323 |
Patent Country: | USA |
Patent Number: | 08906778 |
Appears in Collections: | Patents |
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