Title: | Method for fabricating microneedle array and method for fabricating embossing mold of microneedle array |
Authors: | Chiou Jin-Chern Hung Chen-Chun Chang Chih-Wei |
Issue Date: | 30-Sep-2008 |
Abstract: | The present invention discloses a method for fast fabricating microneedle arrays with an embossing process and a method for fabricating an embossing mold of a microneedle array, wherein a master pattern of a high aspect ratio silicon microneedle array is fabricated with a microelectromechanical technology, and the master pattern is used to fabricate an embossing mold; a thermosetting material is filled into the embossing mold; then, baking, pressing and mold-stripping are undertaken; thereby, disposable solid polymer microneedle arrays can be batch-fabricated. |
Gov't Doc #: | B44C001/22 C25F003/00 |
URI: | http://hdl.handle.net/11536/104762 |
Patent Country: | USA |
Patent Number: | 07429333 |
Appears in Collections: | Patents |
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