Title: High frequency reconstruction by linear extrapolation
Authors: Liu, Chi-min
Lee, Wen-chieh
Hsu, Han-Wen
Issue Date: 8-May-2008
Abstract: High frequency components of audio signals are reconstructed from the aspects of envelope and fine detail. The envelopes of the high frequency components are found through linear extrapolation of signals with frequencies lower than a cutoff frequency point. One method of reconstructing high frequency components is based on the linear extrapolation on the logarithm scale magnitudes of the transform coefficients of the audio signal in a frequency domain. The linear extrapolation is a linear approximation based on minimizing least squares of the logarithm scale magnitudes of the transform coefficients of the low frequency components. Another method is based on the linear extrapolation on the logarithm scale magnitudes of the envelope elements of the filterbank signals of the audio signal over a time segment. The linear extrapolation is a linear approximation based on minimizing least squares of the logarithm scale magnitudes of the envelope elements of the low frequency filterbank signals.
Gov't Doc #: G10L019/00
URI: http://hdl.handle.net/11536/105604
Patent Country: USA
Patent Number: 20080109215
Appears in Collections:Patents


Files in This Item:

  1. 20080109215.pdf

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.