Title: | Due-date assignment for wafer fabrication under demand variate environment |
Authors: | Pearn, W. L. Chung, S. H. Lai, C. A. 工業工程與管理學系 Department of Industrial Engineering and Management |
Keywords: | contamination model;due-date assignment;flow time;product mix;wafer fabrication |
Issue Date: | 1-May-2007 |
Abstract: | In the semiconductor industry, dynamic changes in demand force companies to change the product mix frequently and periodically. Assigning tight but attainable due dates is a great challenge under the circumstances that the product mix changes periodically. In this paper, we consider the due-date assignment problem for wafer fabrication and present a due-date assignment model to set manufacturing due dates satisfying the target on-time-delivery rate. The contamination model is applied to tackle the effect of that product mix varies periodically. We demonstrate the effectiveness and accuracy of the proposed model by solving a real-world example taken from a wafer fabrication shop floor in an IC manufacturing factory. |
URI: | http://dx.doi.org/10.1109/TSM.2007.895215 http://hdl.handle.net/11536/10852 |
ISSN: | 0894-6507 |
DOI: | 10.1109/TSM.2007.895215 |
Journal: | IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING |
Volume: | 20 |
Issue: | 2 |
Begin Page: | 165 |
End Page: | 175 |
Appears in Collections: | Articles |
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