Title: 高散熱鑽石複合基板
Diamond Compoite Substrate for Device Thermoangement
Authors: 吳耀銓
WU YEWCHUNG SERMON
國立交通大學材料科學與工程學系(所)
Issue Date: 2016
Gov't Doc #: MOST104-2221-E009-044-MY3
URI: http://hdl.handle.net/11536/130895
https://www.grb.gov.tw/search/planDetail?id=11706550&docId=475687
Appears in Collections:Research Plans