翻轉式晶片C4接合法冶金條件之研究

Title:	翻轉式晶片C4接合法冶金條件之研究 Under-Bump Metallurgy for Flip-Chip C4 Connection
Authors:	邱碧秀楊聰仁交通大學電子研究所
Keywords:	;
Issue Date:	1993
Abstract:
Gov't Doc #:	NSC82-0404-E009-142
URI:	https://www.grb.gov.tw/search/planDetail?id=45837&docId=6582 http://hdl.handle.net/11536/132153
Appears in Collections:	Research Plans