Title: Modeling the valuation process of silicon intellectual property in the semiconductor industry
Authors: Hung, C. L.
Suz, Y. H.
Cheng, Alfred L. -P.
資訊管理與財務金融系 註:原資管所+財金所
Department of Information Management and Finance
Keywords: silicon intellectual property;semiconductor;valuation;contracting
Issue Date: 2007
Abstract: The complexity of IC (Integrated Circuit) design increases as semiconductor fabrication miniaturizes. Assembly of the reusable basic components of the IC design process has become valuable in accelerating development and marketing of new IC applications. As a result, the idea of SIP (Silicon Intellectual Property) has emerged to meet this demand. The purpose of this paper is to develop a SIP valuation model. However, assessing such intangible assets cost high and have a time-consuming negotiation process to safeguard performance. After intensive interviews with SIP providers, we model a SIP valuation process, which incorporates with quality signals, links to the SIP info-mediaries, and augments with the industry dynamics. The results are further suggested to support with Internet SIP malls, which are installed to take the advantages of multimedia interface and real-time archive for facilitating the SIP valuation processes.
URI: http://dx.doi.org/10.1109/IEEM.2007.4419258
http://hdl.handle.net/11536/135130
ISBN: 978-1-4244-1528-1
ISSN: 2157-3611
DOI: 10.1109/IEEM.2007.4419258
Journal: 2007 IEEE INTERNATIONAL CONFERENCE ON INDUSTRIAL ENGINEERING AND ENGINEERING MANAGEMENT, VOLS 1-4
Begin Page: 592
End Page: +
Appears in Collections:Conferences Paper