Quality and Reliability Investigation of Ni/Sn Transient Liquid Phase Bonding Technology

Title:	Quality and Reliability Investigation of Ni/Sn Transient Liquid Phase Bonding Technology
Authors:	Tsai, Tsung-Yen Chang, Yao-Jen Chen, Kuan-Neng 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics
Issue Date:	2015
Abstract:	A submicron of Ni/Sn transient liquid phase bonding at low temperature was investigated to surmount nowadays fine-pitch Cu/Sn process challenge. After bonding process, only uniform and high-temperature stable Ni3Sn4 intermetallic compound was existed. In addition, the advantages of this scheme showed excellent electrical and reliability performance and mechanical strength.
URI:	http://hdl.handle.net/11536/136094
ISBN:	978-1-4799-9928-6
ISSN:	1946-1550
Journal:	PROCEEDINGS OF THE 22ND INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2015)
Begin Page:	35
End Page:	38
Appears in Collections:	Conferences Paper