Introduction to the special issue on the 2004 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Title:	Introduction to the special issue on the 2004 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
Authors:	Pey, KL Trigg, A Chung, S 交大名義發表 National Chiao Tung University
Issue Date:	1-Jun-2005
URI:	http://dx.doi.org/10.1109/TDMR.2005.849903 http://hdl.handle.net/11536/13677
ISSN:	1530-4388
DOI:	10.1109/TDMR.2005.849903
Journal:	IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
Volume:	5
Issue:	2
Begin Page:	167
End Page:	167
Appears in Collections:	Articles

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APA	Pey, K., Trigg, A., & Chung, S. (2005). Introduction to the special issue on the 2004 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). WOS:000230223000001.
Bibtex	@article{Pey2005, title={Introduction to the special issue on the 2004 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)}, author={Pey, KL and Trigg, A and Chung, S}, journal={WOS:000230223000001}, year={2005}, url={https://ir.lib.nycu.edu.tw/handle/11536/13677}, }