Low Temperature Bonding Technology Development for 3D and Heterogeneous Integration

Title:	Low Temperature Bonding Technology Development for 3D and Heterogeneous Integration
Authors:	Chen, Kuan-Neng 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics
Issue Date:	1-Jan-2018
URI:	http://hdl.handle.net/11536/151067
Journal:	2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT)
Begin Page:	79
End Page:	79
Appears in Collections:	Conferences Paper