Title: | HEAT CONDUCTING MODULE |
Authors: | Chi-Chuan WANG Kuo-Wei LIN |
Issue Date: | 2-Mar-2017 |
Abstract: | A heat conducting module includes a main body. The main body includes a first surface and a second surface. The first surface is thermally connected to a heat absorbing body. The second surface is opposite to the first surface and is fluidly connected to a channel. The second surface has a plurality of grooves disposed along a direction. The channel allows a fluid to flow a long the direction. Each of the grooves includes a first sub-groove and at least one second sub-groove. The first sub-groove at least has a third surface close to the first surface. The first sub-groove at least partially communicates with the second sub-groove, and the second sub-groove is at least partially fluidly connected with the third surface. |
Gov't Doc #: | H05K007/20 |
URI: | http://hdl.handle.net/11536/151256 |
Patent Country: | USA |
Patent Number: | 20170064866 |
Appears in Collections: | Patents |
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