Title: Phone-nomenon: A System-Level Thermal Simulator for Handheld Devices
Authors: Chiou, Hong-Wen
Lee, Yu-Min
Shiau, Shin-Yu
Pan, Chi-Wen
Chen, Tai-Yu
交大名義發表
電信工程研究所
National Chiao Tung University
Institute of Communications Engineering
Issue Date: 1-Jan-2019
Abstract: This work presents a system-level thermal simulator, Phone-nomenon, to predict the thermal behavior of smartphone. First, we study the nonlinearity of internal and external heat transfer mechanisms and propose a compact thermal model. After that, we develop an iterative framework to handle the nonlinearity. Compared with a commercial tool, ANSYS Icepak, Phonenomenon can achieve two and three orders of magnitude speedup with 3:58% maximum error and 1:72 degrees C di fference for steady-state and transient-state simulations, respectively. Meanwhile, Phone-nomenon also fits the measured data of a built thermal test vehicle pretty well.
URI: http://dx.doi.org/10.1145/3287624.3287632
http://hdl.handle.net/11536/153678
ISBN: 978-1-4503-6007-4
DOI: 10.1145/3287624.3287632
Journal: 24TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC 2019)
Begin Page: 538
End Page: 543
Appears in Collections:Conferences Paper