Thermal-Aware Logic Block Placement for 3D FPGAs Considering Lateral Heat Dissipation

Title:	Thermal-Aware Logic Block Placement for 3D FPGAs Considering Lateral Heat Dissipation
Authors:	Huang, Juinn-Dar Huang, Ya-Shih Hsu, Mi-Yu Chang, Han-Yuan 交大名義發表 National Chiao Tung University
Keywords:	Three-dimensional integration;3D FPGAs;thermal-aware placement;logic block placement
Issue Date:	2012
URI:	http://hdl.handle.net/11536/16229
ISBN:	978-1-4503-1155-7
Journal:	FPGA 12: PROCEEDINGS OF THE 2012 ACM-SIGDA INTERNATIONAL SYMPOSIUM ON FIELD PROGRAMMABLE GATE ARRAYS
End Page:	268
Appears in Collections:	Conferences Paper