THE RELIABILITY OF MULTILEVEL METALLIZATION ON INGAAS/GAAS LAYERS

Title:	THE RELIABILITY OF MULTILEVEL METALLIZATION ON INGAAS/GAAS LAYERS
Authors:	CHANG, EY CHEN, JS WU, JW LIN, KC 材料科學與工程學系 Department of Materials Science and Engineering
Issue Date:	1994
URI:	http://hdl.handle.net/11536/20057
ISBN:	1-55899-237-5
ISSN:	0272-9172
Journal:	ADVANCED METALLIZATION FOR DEVICES AND CIRCUITS - SCIENCE, TECHNOLOGY AND MANUFACTURABILITY
Volume:	337
Begin Page:	387
End Page:	392
Appears in Collections:	Conferences Paper