Title: Electrical Characterization and Materials Stability Analysis of La2O3/HfO2 Composite Oxides on n-In0.53Ga0.47As MOS Capacitors With Different Annealing Temperatures
Authors: Lin, Yueh Chin
Trinh, Hai Dang
Chuang, Ting Wei
Iwai, Hiroshi
Kakushima, Kuniyuki
Ahmet, Parhat
Lin, Chun Hsiung
Diaz, Carlos H.
Chang, Hui Chen
Jang, Simon M.
Chang, Edward Yi
材料科學與工程學系
電子工程學系及電子研究所
Department of Materials Science and Engineering
Department of Electronics Engineering and Institute of Electronics
Keywords: HfO2;InGaAs;La2O3;metal-oxide-semiconductor (MOS);molecular beam deposition (MBD);post deposition annealing (PDA)
Issue Date: 1-Oct-2013
Abstract: In this letter, a high-k composite oxide composed of La2O3 and HfO2 is investigated for n-In0.53Ga0.47As metal-oxide-semiconductor (MOS) capacitor application. The composite oxide was formed by depositing five layers of La2O3 (0.8 nm)/HfO2(0.8 nm) on InGaAs with post deposition annealing at 500 degrees C. The MOS capacitors fabricated show good inversion behavior, high capacitance, low leakage current, with excellent interface trap density (D-it) of 7.0 x 10(11) cm(-2)eV(-1), small hysteresis of 200 mV and low capacitance equivalent thickness of 2.2 nm at 1 kHz were also achieved.
URI: http://dx.doi.org/10.1109/LED.2013.2272083
http://hdl.handle.net/11536/22686
ISSN: 0741-3106
DOI: 10.1109/LED.2013.2272083
Journal: IEEE ELECTRON DEVICE LETTERS
Volume: 34
Issue: 10
Begin Page: 1229
End Page: 1231
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