Copper electroplating for future ultralarge scale integration interconnection (vol 18, pg 656, 2000)

Title:	Copper electroplating for future ultralarge scale integration interconnection (vol 18, pg 656, 2000)
Authors:	Gau, WC Chang, TC Lin, YS Hu, JC Chen, LJ Chang, CY Cheng, CL 電子工程學系及電子研究所 Department of Electronics Engineering and Institute of Electronics
Issue Date:	1-Sep-2000
URI:	http://dx.doi.org/10.1116/1.1286102 http://hdl.handle.net/11536/30314
ISSN:	0734-2101
DOI:	10.1116/1.1286102
Journal:	JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
Volume:	18
Issue:	5
Begin Page:	2597
End Page:	2597
Appears in Collections:	Articles

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