Title: NOVEL EFFECTS OF HEATING RATE ON THE ACTIVATION RECRYSTALLIZATION OF BORON-IMPLANTED SI SUBSTRATES
Authors: JUANG, MH
CHENG, HC
電子工程學系及電子研究所
Department of Electronics Engineering and Institute of Electronics
Issue Date: 1-Jul-1992
Abstract: The effects of heating rate on the recrystallization and dopant activation, for samples under different implant conditions, have been studied. The as-implanted samples were annealed, at various heating rates, to different preset temperatures but zero holding time. Factors associated with the dopant activation have been evaluated to develop a proper activation mechanism, thus correlating with the experimental results. In the transient annealing, a higher heating rate facilitates the dopant activation via a lower effective activation energy, while lower heating rates inherently own longer effective activating times. Implant conditions strongly determine the degree, impacting the dopant activation, of respective factors. In addition, higher heating rates led to better Si recrystallization.
URI: http://dx.doi.org/10.1016/0038-1101(92)90327-9
http://hdl.handle.net/11536/3363
ISSN: 0038-1101
DOI: 10.1016/0038-1101(92)90327-9
Journal: SOLID-STATE ELECTRONICS
Volume: 35
Issue: 7
Begin Page: 969
End Page: 973
Appears in Collections:Articles