隱形切割應用於藍寶石基板切割之研究

Abstract

摘要 本論文研究之目的在於改善刀輪切割以及一般切割所造成產品良率損失 SD隱形切割是一種全新的切割技術,因為它是完全乾式製程,不需要像刀輪切割需要切削液來幫助切割,以及降低切割時的溫度, 避免作動元件會被清洗水再次污染, 也不需要額外的保護膜,來防止製程、清潔水對結構造成影響，改善一般切割時因表面切割道產生時所造成的熱應力, 製程中產生的切塵污染使切割前必須加入上保護薄膜的作業,提升單位的產值,減少公司對水資源的浪費,達到減能減碳的成效。 研究的目標就是,實際切割公司內的產品,更改其參數,如:切割速度,來達到單位產出的增加,因為LED製程中,切割後的品質達到一定水準,公司就能提升產能跟產值,改變切割的方向提升電性的可靠度,讓無法使用正切的產品,使用背切方式來改善提升POWER亮度

ABSTRACT In this study,a new dicing method called “stealth dicing” is introduced. By improving the cut loss caused by conventional methods like wheel dicing and laser ablation method,the“stealth dicing”(SD) method results in better yield rate and reduction of production cost.Since SD isan innovative dicing method with completely dry process.In contrast with wheel dicing ,the method introduces cutting fluid into the process to maintain the process in a steady temperature and dicing condition,SD nethod reduces the cost of dicing liquid and protection film with deduction of damage and contamination during the process.SD also prevent the thermal stress that may damage the chip edge and reduces the process of water resources is reduced with a risen yield rate .Stealth Dicing process in the common goal of nowadays company-Energy Conservation &Carbon Reduction. We experiment with SD in a real LED production process in this study.By calibration the process parameter like dicing speed,the yield rate has risen.Since dicing quality drastically improves the luminosity and electrical properties of LED chip,the production capability and gross production output rate increased.For products that cannot be diced in front side,we also incorporate SD method with back side dicing,which yields a better reliability,luminosity and power performance.