| Title: | 覆晶銲錫接點電遷移孔洞生成機制之研究 Mechanisms of Void Formation of Flip-Chip Solder Joints during Electromigration |
| Authors: | 陳智 Chen Chih 交通大學材料科學與工程系 |
| Issue Date: | 2006 |
| Gov't Doc #: | NSC95-2218-E009-022 |
| URI: | http://hdl.handle.net/11536/89262 https://www.grb.gov.tw/search/planDetail?id=1192378&docId=225645 |
| Appears in Collections: | Research Plans |
- Study of electromigration of flip-chip solder joints using Kelvin probes / Chang, Y. W.;Chen, Chih
- Effects of current crowding and Joule heating on reliability of solder joints / Liang, S. W.;Chiu, S. H.;Chen, Chih
- <111>奈米雙晶銅墊層之銲錫接點的電遷移及界面冶金反應研究 / 陳智;Chen Chih
- Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish / Chu, Ming-Hui;Liang, S. W.;Chen, Chih;Huang, Annie T.
- 以凱文結構與三維模擬研究電遷移造成覆晶銲錫接點中孔洞的形成 / 張元蔚;陳智
- Study of electromigration-induced formation of discrete voids in flip-chip solder joints by in-situ 3D laminography observation and finite-element modeling / Chang, Yuan-Wei;Cheng, Yin;Xu, Feng;Helfen, Lukas;Tian, Tian
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