| Title: | 矽氧烷及亞醯胺改質之環氧樹脂做為高密度印刷電路板材料之研究(II) Research on the Siloxane and Imide Modified Epoxies for High Density Printed Circuit Boards(II) |
| Authors: | 林木獅 LIN MU-SHIH 交通大學應用化學系 |
| Issue Date: | 2005 |
| Gov't Doc #: | NSC94-2216-E009-005 |
| URI: | http://hdl.handle.net/11536/90280 https://www.grb.gov.tw/search/planDetail?id=1094900&docId=206350 |
| Appears in Collections: | Research Plans |
- 矽氧烷及亞醯胺改質之環氧樹脂做為高密度印刷電路板材料之研究(I) / 林木獅;LIN MU-SHIH
- Siloxane- and imide-modified epoxy resin cured with siloxane-containing dianhydride / Li, HT;Lin, MS;Chuang, HR;Wang, MW
- 矽氧烷與亞醯胺改質之雙丙烯雙酚、含矽氧烷雙馬來亞醯胺與氰酸酯材料交聯行為與物性研究及其在高密度印刷電路板之應用 / 林木獅;LIN MU-SHIH
- 新穎含矽氧烷、醯亞胺聚氧代氮代苯并環己烷材料製備及其特性之研究 / 陳凱琪;Chen, Kai-Chi;孫建文;張豐志;Sun, Kein-Wen
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