Title: 高性能混和訊號式介面積體電路---子計劃III:5 GHz高性能無線通訊系統中主要積體電路的設計與整合(I)
The Design and Integration of Key Component ICs for 5 GHz High Performance Wireless Communication System(I)
Authors: 吳重雨
CHUNG-YUWU
交通大學電子工程系
Issue Date: 2002
Gov't Doc #: NSC91-2215-E009-080
URI: http://hdl.handle.net/11536/92887
https://www.grb.gov.tw/search/planDetail?id=784532&docId=150805
Appears in Collections:Research Plans


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