銅導線及其障礙層之材質研究(II)

Title:	銅導線及其障礙層之材質研究(II) Microstructural Study of Copper Interconnect and Diffusion Barriers(II)
Authors:	張立 CHANG LI 國立交通大學材料科學工程研究所
Issue Date:	2000
Gov't Doc #:	NSC89-2218-E009-068
URI:	http://hdl.handle.net/11536/93730 https://www.grb.gov.tw/search/planDetail?id=597337&docId=112563
Appears in Collections:	Research Plans

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