| Title: | 塑膠基板上半導體元件的關鍵製作技術研發 The Development of Key Process to Fabricate Semiconductor Devices on Plastic Substrate |
| Authors: | 葉清發 國立交通大學電子工程學系 |
| Issue Date: | 2000 |
| Gov't Doc #: | NSC89-2215-E009-093 |
| URI: | http://hdl.handle.net/11536/93836 https://www.grb.gov.tw/search/planDetail?id=583849&docId=109696 |
| Appears in Collections: | Research Plans |
- 塑膠基板上半導體元件之試作 / 施鴻民;Shih Hung-Ming;葉清發;Prof. Ching-Fa Yeh
- 低熔點基板上主動式元件關鍵製程開發 / 黃建凱;Chien-Kai Huang;葉清發;Ching-Fa Yeh
- Device transfer technology by backside etching (DTBE) for poly-Si thin-film transistors on glass/plastic substrate / Wang, SC;Yeh, CF;Huang, CK;Dai, YT
- Very low noise RIF nMOSFETs on plastic by substrate thinning and wafer transfer / Kao, HL;Hung, BF;Chin, A;Lai, JM;Lee, CF
- Fabrication of thin-film transistors on plastic substrates by spin etching and device transfer process / Wang, SC;Hsu, CT;Yeh, CF;Lou, JC
- Fabricating thin-film transistors on plastic substrates using spin etching and device transfer / Wang, SC;Yeh, CF;Hsu, CT;Lou, JC
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