| Title: | 積體電路化學品與材料之開發---子計畫II：化學機械研磨材料於積體電路製程之應用研究(II) Application of Chemical Mechanical Polishing Materials in IC Manufacturing (II) |
| Authors: | 馮明憲 交通大學材料科學與工程研究所 |
| Keywords: | 化學機械拋光;積體電路;製程;Chemical mechanical polishing;Integral circuit (IC);Process |
| Issue Date: | 1999 |
| Gov't Doc #: | NSC88-CPC-E009-015 |
| URI: | http://hdl.handle.net/11536/94189 https://www.grb.gov.tw/search/planDetail?id=461617&docId=84632 |
| Appears in Collections: | Research Plans |
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