| Title: | 無線通訊用積層微波陶瓷元件之研發---子計畫II：高頻用積層微波材及界面電極研究(II) Multilayer Microwave Materials and Internal Electrode for High Frequency Communication Devices (II) |
| Authors: | 陳三元 CHEN SAN-YUAN 交通大學材料科學與工程研究所 |
| Keywords: | 微波元件;無線通訊;內電極;溶膠凝膠法;低溫共燒;Microwave device;Wireless communication;Internal electrode;Sol-Gel process;Low-temperature co-firing |
| Issue Date: | 1999 |
| Gov't Doc #: | NSC88-2213-E009-131 |
| URI: | http://hdl.handle.net/11536/94449 https://www.grb.gov.tw/search/planDetail?id=444162&docId=80432 |
| Appears in Collections: | Research Plans |
- 高頻用積層微波材料及界面電極研究(III) / 陳三元;CHEN SAN-YUAN
- 無線通訊用積層微波陶瓷元件之研發---總計畫(II) / 林鵬;LIN PANG
- 無線通訊用積層微波陶瓷元件之研發---子計畫I：微波介電材料低溫燒結及積層技術(II) / 林鵬;LIN PANG
- 高頻低溫共燒電極塗料研究 / 陳三元;Chen, San-Yuan;周錦奐;Chou, Ching-Huan
- Microwave dielectric properties of glass-ceramic composites for low temperature co-firable ceramics / Cheng, CC;Hsieh, TE;Lin, IN
- 薄膜型微波通訊被動元件之設計與製作---子計畫II：高介電薄膜型微波通訊被動元件之研製(II) / 林鵬;LIN PANG
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