| Title: | 高密度電子構裝接合與測試載具的開發---子計畫III：多層傳導結構基板之可靠度提升與製作研究(III) A Study of Reliability Enhancement and Fabrication of Multilayer Interconnection Substarte (III) |
| Authors: | 謝宗雍 HSIEH TSUNG-EONG 交通大學材料科學與工程系 |
| Keywords: | 多層連線;基板;平坦化;銅導孔柱;Multilayer interconnection;Substrate;Planarization;Cu via pillar |
| Issue Date: | 1999 |
| Gov't Doc #: | NSC88-2216-E009-013 |
| URI: | http://hdl.handle.net/11536/94468 https://www.grb.gov.tw/search/planDetail?id=429291&docId=76850 |
| Appears in Collections: | Research Plans |
