銲錫接點熱疲乏斷裂之研究---無鉛焊錫(II)

Title:	銲錫接點熱疲乏斷裂之研究---無鉛焊錫(II) Thermal Fatigue Fracture of Solder Joint---Unlead Solder(II)
Authors:	邱碧秀 CHIOU BI-SHIOU 國立交通大學電子工程學系
Keywords:	電子構裝;可靠度;焊錫接點;熱疲乏;無鉛焊錫;Electronic package;Reliability;Solder joint;Thermal fatigue;Unlead solder
Issue Date:	1996
Gov't Doc #:	NSC85-2215-E009-066
URI:	http://hdl.handle.net/11536/95644 https://www.grb.gov.tw/search/planDetail?id=230177&docId=41820
Appears in Collections:	Research Plans

APA	邱., & CHIOU B. (1996). 銲錫接點熱疲乏斷裂之研究---無鉛焊錫(II). https://www.grb.gov.tw/search/planDetail?id=230177&docId=41820.
Bibtex	@article{1996, title={銲錫接點熱疲乏斷裂之研究---無鉛焊錫(II)}, author={邱碧秀 and CHIOU BI-SHIOU}, journal={https://www.grb.gov.tw/search/planDetail?id=230177&docId=41820}, year={1996}, url={https://ir.lib.nycu.edu.tw/handle/11536/95644}, }