封裝微帶線電路中部分封閉吸收性共振腔之分析

Title:	封裝微帶線電路中部分封閉吸收性共振腔之分析 Analysis of a Partially Sealed Absorbing Cavity in a Packaged Microstrip Circuit
Authors:	鍾世忠 CHUNG SHYH-JONG 國立交通大學電信工程學系
Keywords:	封裝微帶線;高階模;金屬隔板;吸收性共振腔;Packaged microstrip circuit;Higher-order mode;Metal diaphragm;Absorbingcavity
Issue Date:	1996
Gov't Doc #:	NSC85-2213-E009-001
URI:	http://hdl.handle.net/11536/96061 https://www.grb.gov.tw/search/planDetail?id=238191&docId=43992
Appears in Collections:	Research Plans