球柵矩陣型積體電路焊線製程參數最佳化之設計

Title:	球柵矩陣型積體電路焊線製程參數最佳化之設計 An Intelligent Approach for Simultaneous Optimization of a BGA Wire Bonding Process
Authors:	蘇朝墩 SU CHAO-TON 國立交通大學工業工程與管理學系
Keywords:	引線接合;球柵矩陣型積體電路;製程設計;最佳化;Wire bonding;BGA;Process design;Optimization
Issue Date:	2001
Gov't Doc #:	NSC90-2218-E009-008
URI:	http://hdl.handle.net/11536/96785 https://www.grb.gov.tw/search/planDetail?id=674233&docId=128513
Appears in Collections:	Research Plans

Files in This Item:

If it is a zip file, please download the file and unzip it, then open index.html in a browser to view the full text content.